The 4th Technion-Intel Challenge invites you to challenge the next generation
depth sensing technologies (3D cameras), deep learning techniques and IoT
devices, and to the opportunity to early access to the latest Intel products and
to take part in shaping the future of robotics, drones, autonomous navigation,
smart homes, scene understanding, VR/AR/MR, HMI, deep learning, and more.
The event will take place on Sunday, March 19, 2017, 13:00-15:00, in Room 1003, EE
Meyer Building and will offer demos, trending technologies, mingling and
You are all invited!